xMEMS Labs has launched the XMC-2400, a groundbreaking micro-cooling chip that uses sound waves to move air and cool down electronics.
This tiny chip, just 1mm thin and weighing under 150 milligrams, is designed for ultra-thin devices like smartphones, tablets, laptops, SSDs, and even advanced AI gadgets.
Unlike traditional fans, the XMC-2400 is a solid-state, all-silicon device that creates silent, vibration-free airflow by operating at ultrasonic frequencies.
It can push up to 39 cubic centimetres of air per second and generate 1,000Pa of back pressure, all while being completely inaudible and using only about 30mW of power-far less than most active-cooling solutions.
The chip is 96% smaller and lighter than regular active-cooling fans, making it perfect for today’s slim and powerful devices. It’s also IP58 rated for water and dust resistance, ensuring durability in tough environments.
xMEMS’ CEO, Joseph Jiang, highlighted that as devices get thinner and start running more AI-powered applications, keeping them cool is a growing challenge. The XMC-2400 arrives just in time, offering manufacturers a practical way to manage heat without making devices bulkier or noisier.
Compared to other solid-state cooling chips like the AirJet Mini, the XMC-2400 stands out for its tiny size, lower power use, and higher cooling efficiency-delivering 16 times better cooling per size.
Samples of the XMC-2400 will be available to customers in the first quarter of 2025, with demonstrations planned in Shenzhen and Taipei. Mass production is expected to follow in 2026. This innovation could soon become a standard feature in the next generation of high-performance, ultra-thin electronics.